Intel® Xeon® Gold Processors - Intel® Xeon® Gold Processors - Introducing 3rd Gen Intel Xeon Scalable processors, a balanced architecture with built-in acceleration and advanced security capabilities, designed through decades of innovation for the most in-demand workload requirements.
3rd Gen Intel® Xeon® Scalable processors are the only data center CPU with built-in AI acceleration, supported by end-to-end data science tools, and a vast ecosystem of smart solutions.
Intel® Optane™ Persistent Memory
A new foundation for performance begins with support for Intel's breakthrough Intel Optane persistent memory, delivering up to 36TB of system-level memory capacity when combine with traditional DRAM, helping to transform critical data workloads-from cloud and databases to In-memory analytics, and content delivery networks, now supported by select Intel® Xeon® Scalable processors.
Advanced Security Technologies
3rd Gen Intel® Xeon® Scalable processors include Intel® SGX, which protects data and application code in real-time from the edge to the data center and multi-tenant public cloud, enabling enhanced collaboration (for example for federated learning in AI) using shared data-without compromising privacy.
Product Information |
|
| Transource eSKU |
1000319225 |
| Manufacturer |
Intel Corporation |
| Manufacturer Part Number |
CD8068904572101 |
| Manufacturer Website Address |
http://www.intel.com |
| Brand Name |
Intel |
| Product Line |
Xeon Gold |
| Product Series |
6300 |
| Product Model |
6330 |
| Product Name |
Xeon Gold Octacosa-core 6330 2.0GHz Server Processor |
| Package Type |
OEM |
| Product Type |
Processor |
Technical Specifications |
|
Technical Information |
| Processor Manufacturer |
Intel |
| Processor Core |
Octacosa-core (28 Core) |
| Clock Speed |
2 GHz |
| Overclocking Speed |
3.10 GHz |
| L3 Cache |
42 MB |
| 64-bit Processing |
Yes |
| Process Technology |
10 nm |
| Processor Threads |
56 |
| Processor Socket |
Socket LGA-4189 |
| Processor Generation |
3rd Gen |
Power Description |
| Thermal Design Power |
205 W |
Environmental Conditions |
| Thermal Specification |
186.8°F (86°C) |
Physical Characteristics |
| Width |
3.1" |
| Depth |
2.2" |
Miscellaneous |
| Compatibility |
Intel® C620 Series Chipsets Intel® C629A Chipset
Intel® C627A Chipset
Intel® C621A Chipset |
